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Toshiba, Tessera sign expanded agreement for CSP

Posted: 31 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:FBGA package? CSP? Toshiba? consumer electronic? communication?

Tessera Technologies Inc., a provider of chip-scale and multi-chip packaging solutions, has signed an expanded technology licensing agreement with Toshiba Corp. that enables Tessera to act as a licensor of Toshiba's fine-pitch BGA (FBGA) assembly process for "face-up" CSP.

Utilizing Tessera's core CSP patents, these FBGA packages, also marketed by Tessera as 5BGA-F packages, are used by Toshiba in many applications, including logic, memory and multichip devices, which are incorporated into a range of computing, communications and consumer electronic products.

Tessera is also authorized to use Toshiba's assembly process for face-up CSPs, and to sub-license this process to other licensees. As a result, Tessera can provide its licensees with an expanded range of proven packaging processes that meet the needs of current and next-generation applications requiring CSP technology.

Additionally, Toshiba will transfer technical and engineering information related to the high-volume assembly of face-up CSPs to Tessera. Toshiba may also assist Tessera in providing technical consultation and assistance to its licensees, enabling them to quickly and efficiently initiate and ramp CSP production. Tessera will offer this technology, in the form of expanded licensing, technical training, consulting, and other licensee services, to its licensee base of semiconductor manufacturers and assemblers by the fourth quarter of 2002.

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