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STATS PBGA package improves thermal performance

Posted: 31 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:xdpbga? plastic ball grid array? exposed drop in heat spreader pbga? ic package?

ST Assembly Test Services (STATS) Ltd has introduced the Exposed Drop In Heat Spreader PBGA (XDPBGA) package that offers better thermal performance compared to traditional die-down packages.

A typical 35-by-35mm (388-ball), four-layer XDPBGA package has a thermal performance of 13.70C/Wlower than the 22.40C/W offered by PBGA package.

Suitable for packaging DSPs, ASICs, microprocessors/controllers, and PC chipsets and graphics processors, the XDPGBA package is available in sizes of 19-by-19mm to 40-by-40mm with 1mm and 1.27mm ball pitch. It also offers multiple routing layers for high-density routing and perimeter or full ball array design.





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