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Using convection ovens for attaching Z-COMM VCOs

Posted: 06 May 2002 ?? ?Print Version ?Bookmark and Share

Keywords:reflowing? convection oven? solder? spike stage? vco?

This application note describes the suggested time-temperature reflow profile for properly attaching of Z-COMM VCOs to PCBs utilizing convection oven techniques.

View the PDF document for more information.

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