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Manufacturing/Packaging??

RVSI receives order for 3-D wafer inspection system

Posted: 11 Jun 2002 ?? ?Print Version ?Bookmark and Share

Keywords:RVSI? WS series? bumped wafer? inspection system? materials?

Robotic Vision Systems Inc. (RVSI) has received an order for a WS series bumped wafer inspection system from an undisclosed major supplier of materials for BGA semiconductors. The system will be used for 3-D defect inspection of semiconductor wafers at the company's technical and customer demonstration center in Japan.

Rather than traditional wire bonds, the latest generation of ICs utilize microscopic-sized solder or gold "bumps" that are directly deposited on the wafer for electrical connections. RVSI's WS series is expected to improve yield management of bumped wafers and flip-chip die, providing a method to maximize yields and profitability by performing surface-defect inspection of the wafer and inspecting bump parameters at high production rates.

The WS series' capabilities also include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps, as well as wafer surface defects.





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