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Rudolph develops enhanced metrology solutions

Posted: 14 Jun 2002 ?? ?Print Version ?Bookmark and Share

Keywords:International Technology Roadmap for Semiconductors? semiconductor? copper process solution? ultra-thin barrier film? barrier sidewall?

Rudolph Technologies Inc., a manufacturer of process control equipment, has developed an enhanced metrology solutions roadmap to address the technology requirements outlined in the 2001 International Technology Roadmap for Semiconductors (ITRS).

The Rudolph roadmap builds on the company's solutions that have already met the metrology needs of major semiconductor device manufacturers. The company's latest copper process solutions enable measurements of ultra-thin barrier films, barrier sidewall coverage, and post-CMP copper and ILD thickness of high-aspect ratio sub-micron lines.

In addition, the roadmap supports next-generation technologies including oxynitrides and high-k materials, poly-SiGe and metals, and a variety of lower-k inter-level dielectric (ILD) materials. Rudolph's metrology solutions will also support SiGe transistors to enable higher speeds and mixed-signal processing.





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