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ChipPAC develops CSP for handheld consumer applications

Posted: 18 Jun 2002 ?? ?Print Version ?Bookmark and Share

Keywords:CSP? mobile applications? handheld consumer applications? DSP? wireless chipsets?

ChipPAC Inc. has developed a high density, high reliability, lead-free chip-scale package (CSP) for mobile applications. This package is suited for handheld consumer applications which feature DSP, wireless chipsets and RF modules.

According to ChipPAC, this CSP was designed with 341 lead-free solder balls at 0.5mm pitch and has received a Moisture Resistance Test (MRT) level 1, the highest moisture resistance possible. ChipPAC designed and simulated the electrical and thermal performance, particularly the board level reliability, using its proprietary SmartDESIGN process.

"The achievement of MRT Level 1 CSPs allows the board assembly to be done without consideration to the time the package has been exposed to moisture. The result is higher yields and greater manufacturing flexibility for OEMs and EMS companies and a lower cost of ownership for our wireless applications customers," Dennis McKenna, chairman and CEO of ChipPAC said.

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