Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > RF/Microwave
?
?
RF/Microwave??

Ericsson Bluetooth MCM is 70 percent smaller

Posted: 18 Jun 2002 ?? ?Print Version ?Bookmark and Share

Keywords:rok104001? bluetooth multichip module? bluetooth 1.1 module? bluetooth embedded application?

Ericsson Microelectronics has announced the availability of the ROK104001 Bluetooth multichip module (MCM) that is 70 percent smaller than its predecessor and is designed to speed time-to-market by enabling designers to implement qualified and tested alternatives to chipset solutions.

Suitable for embedded and host-based applications, the MCM includes a baseband with 4Mb or 8Mb internal Flash memory, a radio transceiver, a reference crystal and Host Controller Interface level embedded software. It has class 2 output power and will drive up to seven slave units.

The Bluetooth baseband controller is based on an Ericsson Bluetooth IP core, an ARM7 TDMI processor and has 64KB of RAM, enabling embedded software to be seamlessly integrated into the device.

The ROK104001 supports both data and voice transmissions and a variety of industry protocols including USB, UART and PCM. It also contains the full range of power management elements such as PARK, SNIFF and HOLD. A GPIO interface is also available for embedded applications designers.

The module provides inband blocking of a maximum input level to 15dBm and outband blocking across the whole GSM band, as well as the 2.4GHz and 5GHz WLAN bands.

The ROK104001 is qualified to the Bluetooth 1.1 specification and is shipped in an LGA package with 1.27 mm pitch. It also does not require microvias or fine pitch PCB, allowing a low cost PCB to be used reducing complexity and cost.





Article Comments - Ericsson Bluetooth MCM is 70 percent...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top