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Seiko Epson certifies Electroglas in LCD wafer inspection

Posted: 20 Jun 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Seiko Epson? QuickSilver IIe? inspection system? LCD driver circuit? advanced imaging platform?

Seiko Epson Corp., a supplier of information-related equipment and semiconductor components, has qualified Electroglas Inc.'s QuickSilver IIe inspection system for LCD driver circuit production.

QuickSilver IIe provides Seiko Epson with quality assurance and process control information on gold- bumped LCD die used in moving-image cell phones and other low-energy consumption end-use applications. QuickSilver IIe is based on Electroglas' Advanced Imaging Platform (AIP) which permits wafer inspection on complex final wafer patterns prior to and following electrical test and wafer-level assembly.

The system was modified from its standard gold bump inspection configuration to provide a specific illumination, image processing and data analysis capabilities for Seiko Epson. These enhancements allow Seiko Epson to combine the results of electrical wafer probing with the automated inspection information generated by QuickSilver IIe.

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