Philips IC package exhibits better thermal resistance

The QLPAK semiconductor package from Royal Philips Electronics features a thermal resistance of 1.5K/Wlower than the 20K/W value of a typical SO8 packageand is suited for use in high-density power applications such as dc/dc converters for telecommunications equipment.

The package occupies the same 6-by-5mm PCB area as a conventional SO8 package, but is claimed to be 50 percent thinner, resulting to smaller, cooler, and more efficient designs.