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Philips IC package exhibits better thermal resistance

Posted: 24 Jun 2002 ?? ?Print Version ?Bookmark and Share

Keywords:qlpak? ic package? so8? dc/dc converter package? power ic package?

The QLPAK semiconductor package from Royal Philips Electronics features a thermal resistance of 1.5K/Wlower than the 20K/W value of a typical SO8 packageand is suited for use in high-density power applications such as dc/dc converters for telecommunications equipment.

The package occupies the same 6-by-5mm PCB area as a conventional SO8 package, but is claimed to be 50 percent thinner, resulting to smaller, cooler, and more efficient designs.

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