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Motorola, DA NanoMaterials to collaborate on copper CMP solution

Posted: 01 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:DuPont Air Products NanoMaterials? copper chemical mechanical planarization?

Motorola Inc.'s Semiconductor Products Sector and DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a joint venture between Air Products and Chemicals Inc. and DuPont, have agreed to collaborate on an advanced copper chemical mechanical planarization (CMP) formulation.

Under the agreement, Motorola will provide its CMP formulation for 0.135m to 0.15m design rules to DA NanoMaterials, who will manufacture and market the slurry formulation globally. The advanced slurry will be marketed under DA NanoMaterials' Ascend trademark.

Motorola will also provide for the transfer of the licensed technology as well as technical support and training, while DA NanoMaterials will provide the capability for installation and manufacture of the slurry and quality control via its production facility in Ruabon, Wales.

"Our relationship with Motorola will allow us to include a copper slurry in our product portfolio which will provide customers with a high performing, cost effective solution for the first step copper polishing process," said Robert B. Grashoff, CEO of DA NanoMaterials. "We will be able to offer these benefits now and in the future by combining an advanced copper process developed by Motorola, along with the global supply chain, application support and slurry expertise demonstrated by DA NanoMaterials."

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