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Infineon, Delta enter technology transfer agreement

Posted: 02 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Delta Electronics? Cyntec? MegaDIP? transfer mold packaging technology? Integrated Power Electronics Modules?

Infineon Technologies AG and Delta Electronics Inc. have entered into an agreement for the licensing and transfer of MegaDIP, Infineon's transfer mold packaging technology, to Delta subsidiary Cyntec.

Under this agreement, Infineon will also supply at least 50 percent of the power semiconductors needed by Cyntec, to be incorporated into products manufactured using this technology. The MegaDIP technology is expected to enable Cyntec to supply cost-effective integrated power electronics modules (IPEM) with superior thermal characteristics.

This partnership is further aimed at addressing the power electronics market for small power industrial drives, consumer drives and power supply modules for PCs. Both companies intend to do this by combining the power semiconductors and packaging expertise of Infineon, with the power electronics system and manufacturing expertise of Delta.

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