Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

NEXX Systems joins SECAP

Posted: 04 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Semiconductor Equipment Consortium for Advanced Packaging? PVD systems? under bump metallurgy? NEXX's Cirrus? NEXX Nimbus?

NEXX Systems, a supplier of PVD systems, joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP). With the membership of NEXX, under bump metallurgy (UBM) and backside metallization have been added to the consortium's equipment portfolio.

NEXX markets and manufactures product lines which provide process equipment solutions for the advanced packaging and telecommunications industries. NEXX's Cirrus provides process capability for the manufacture of optoelectronic devices for telecommunications, while the Nimbus is a tool designed specifically for UBM, backside metallization and high-density substrates for the advanced packaging market. The company's other capabilities include the process for manufacturing active and passive optical devices fabricated from silicon and compound semiconductors.

According to SECAP, the entry of NEXX will assist the consortium in pursuing its goal of supporting the advanced packaging industry with dedicated process equipment.

Article Comments - NEXX Systems joins SECAP
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top