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Unitive adopts Semitool's packaging platform

Posted: 05 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Unitive? Advanced Packaging Platform? wafer-level packaging? electroplating?

Semitool Inc. has announced the delivery of its electroplating system product, the Advanced Packaging Platform (APx), to Unitive Inc., a provider of wafer-level packaging solutions.

According to Semitool, the APx features a smaller, more open design to enable better visibility during wafer processing. The APX also facilitates rapid prototyping and analysis by supplying multiple electrolytes for metal and alloy plating, etch and stripping chemistries. In addition, the tool has been designed with an open design of the chemistry deck which allows easy access for the packaging engineer and service personnel.

"Electroplating is the deposition method of choice for solder wafer-level packaging," said Paul Siblerud, general manager for Semitool's packaging division. "Our development of the APx incorporates the latest plating technology and is designed specifically for the cost sensitive packaging market. APx's open design and small tool philosophy match the need for advanced technology in an affordable package."





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