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STATS rolls out advanced version of EBGA package

Posted: 08 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Enhanced Ball Grid Array Build Up package? EBGA package? broadband? WAN?

ST Assembly Test Services Ltd (STATS) has introduced its latest thermal array product, the Enhanced Ball Grid Array Build Up (EBGA-A) package, an advanced version of the traditional EBGA package.

The EBGA-B package was developed with a build up technology for the substrate layers. According to STATS, the package offers higher I/O in a thin profile and better thermal and electrical performance compared with the conventional EBGA, with a 30 percent improvement in the thermal performance based on a 35-by-35mm body size.

The EBGA-B package is designed for applications such as networking, broadband, WAN and high-end digital consumer applications. It is particularly suitable for use in Gigabit Ethernet, xDSL modems, switches and network processors, digital TV receiver and game consoles.

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