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RVSI ball placement system targets grid array packages

Posted: 18 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:robotic vision systems? rvsi? sp 6800? ball placement system? ball placement machine?

Robotic Vision Systems Inc. (RVSI) has announced the release of the SP-6800 high-volume ball placement system that is designed to address the high throughput requirements of grid array package manufacturing.

Designed to deliver high-speed ball placement for SBGA, FPBGA, CSP, and strip applications, the device uses the company's Positive Mask ball placement technology to achieve the high throughput placement. The technology enables the SP-6800 to place every ball on every pad simultaneously, unlike conventional systems, which employ a selective placement process.

The 1.3-by-1.1-by-1.54m device also has the ability to process two strips during a single processing cycle further improving throughput and flexibility. Utilizing a unique tooling design, two substrates are processed simultaneously, maximizing machine utilization, and effectively doubling the capacity of the machine.

It also has an advanced vision system that is combined with the company's Visionscape inspection platform with high-resolution CCD camera technology to ensure ball integrity and full ball pick-up prior to placement. Following placement, the system inspects for ball quality and location.





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