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Matsushita Electric develops surface mount technology

Posted: 18 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:surface mounting technology? AdITR? Adhesive Interconnection Technology?

Matsushita Electric Ind. Co. Ltd has developed a surface-mounting technology called AdITR (Adhesive Interconnection Technology) that uses conductive adhesives. The AdITR makes it possible for high-density surface mounting at significantly lower temperature than solder, making it applicable to components with low resistance to heat.

According to the company, the AdITR is superior both to conventional solder mounting and previous conductive adhesives. This newly developed conductive adhesive is cured at low temperatures around 1500C, so it can be used to mount modules incorporating temperature-sensitive elements, such as the camera lenses employed in some mobile phone handsets. It is also suitable for highly precise high-density mounting since the minimum printing distance between lines is about 0.2mm. This makes AdITR a valuable tool in the development of products where small size is essential, such as mobile phone handsets and compact AV equipment.

In addition to the greater flexibility AdITR offers to designers of new products, it also provides environmental advantages. AdITR employs no toxic substances such as lead or VOC (volatile organic compounds), and since it uses no flux there is no need for a separate cleaning process to remove solder residue.

Finally, the AdITR can also be combined with solder mounting since the conductive adhesives used do not remelt at the reflow soldering temperature. This means that a module made using AdITR can be mounted onto a circuit board or another module using solder mounting.

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