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Amkor, IBM partner on flip-chip technology offerings

Posted: 19 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:IBM? Flip Chip? substrates? packaging? engineering services?

Amkor Technology Inc. and IBM have agreed to collaborate on the design and production of flip-chip substrates and packaging. The partnership is expected to enable IBM to offer its flip-chip substrate technology to more customers and allow Amkor to enhance its position in the flip-chip manufacturing and technology development.

IBM will provide for the front-end engineering services, including electrical, thermal and mechanical modeling, substrate design, as well as their flip-chip substrates. These substrates include IBM's Build Up technology and MLC. Amkor, for its part, will provide flip-chip design and assembly services at its various facilities in Asia, including Taiwan, China, South Korea and the Philippines. Customers may then work directly with both Amkor and IBM.

"IBM's expertise in design, characterization, and manufacturing of flip-chip substrates, when allied with Amkor's flip-chip packaging and assembly manufacturing capability, can provide the semiconductor industry with a powerful tool to facilitate the conversion to flip-chip solutions," said Hal M. Lasky, IBM's director, Interconnect Products Business Line.





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