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Tegal joins the IC packaging alliance

Posted: 19 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Advanced Packaging and Interconnect Alliance? APiA? IC? packaging? interconnect?

Tegal Corp. has joined the Advanced Packaging and Interconnect Alliance (APiA). Tegal's membership is expected to strengthen APiA's position in the IC packaging and interconnect industry.

"We expect that Tegal's expertise in new material etch will serve our future customers in wafer-level chip scale packaging (WLCSP) applications," said Jim McKibben, VP of worldwide marketing and sales for Tegal. "Tegal has developed a suite of processes for the plasma etch of a variety of metal films incorporated in chip scale packages. We also have well characterized dry etch solutions for processing the thick organic films common in WLCSP. We are excited by the prospects of working in collaboration with other APiA members to create new process solutions for advanced packaging applications."

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