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ACM Research rolls latest copper plating process

Posted: 22 Jul 2002 ?? ?Print Version ?Bookmark and Share

Keywords:electro-copper plating? ECP? copper film? wafers? bump?

ACM Research, a provider of plating and polishing processes for copper interconnect technology, has revealed that its latest electro-copper plating (ECP) process can create a copper film on patterned wafers that is virtually hump-free in fine, dense-trench areas and dishing-free in wide trench areas and over the (bump) pads.

With ECP's planarity, the process is expected to eliminate the planarization process and help solve major industry hurdles related to polishing copper.

"Our hump-free, dishing-free and contact-free ECP plating process combined with our earlier introduced stress-free polishing process provides the industry with a suitable approach to integrate copper with low-k and ultra low-k dielectrics," said ACM founder and CEO David Wang. "Our unique approach is aimed at eliminating the problems by employing a true (CMP) pad-free, no-contact and no-stress process. ACM's results to date give us confidence that we'll achieve the same high yield and reliability as in earlier generation aluminum processes."

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