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DDi applies proprietary technology for patenting

Posted: 01 Aug 2002 ?? ?Print Version ?Bookmark and Share

Keywords:flat-pad? microvia? hdi? pcb? vip?

DDi Corp., a provider of interconnect services for the electronics industry, has filed its newly developed "Flat-Pad" technology for High Density Interconnect (HDI) PCB applications in the U.S. Patents and Trademark Office.

According to the company, unlike traditional laser-formed microvia approaches, DDi's proprietary Flat-Pad technology results in a completely flat BGA component pad surface which not only supports the current industry thrust toward Via-in-Pad (VIP) design, but also widens the process window for PCB assembly.

Matt LaRont, director of PCB Global Supply Base Management for Solectron Corp., comments that DDi's technology represents "an exciting approach towards overcoming the challenges commonly encountered in HDI manufacturing and assembly."

The DDi technology is geared to eliminate or at least minimize the current industry's problem with solder voids, which Solectron's laboratory testing indicates is caused by conventional microvia approaches.

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