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Amkor qualifies Strand substrates for leadframe packaging

Posted: 19 Aug 2002 ?? ?Print Version ?Bookmark and Share

Keywords:Amkor Technology? Strand Interconnect? SiliconMate substrates? MQFP leadframe package?

Amkor Technology Inc. has qualified Strand Interconnect's SiliconMate substrates for its MQFP family of leadframe packages. According to Amkor, silicon-based substrate technology provides high density interconnect for multi-chip lead frame packages, enabling silicon technology combinations for improved functionality and density inside the MQFP package.

"The qualification of Strand's silicon-based substrates in our MQFP packages will enhance our ability to provide innovative multi-chip package solutions," said Sean Crowley, Amkor's VP of advanced leadframe products. "We will consider expanding our use of silicon substrates in other package families since the substrates are easy to integrate into our process flow and act just like another die in a package."

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