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STATS EBGA package offers more I/O

Posted: 26 Aug 2002 ?? ?Print Version ?Bookmark and Share

Keywords:stats? st assembly test services? ebga m? ebga package? ball grid array?

ST Assembly Test Services (STATS) Ltd. has launched the EBGA Multi-Tier (EBGA-M) package that offers higher I/O and multiple wire bonding zones for power, ground, and signal connection.

Designed for use with power semiconductors used in high-end networking, broadband, and WAN applications, the packaging option provides up to eight substrate layers in a die-down architecture to improve electrical and thermal performance.

The EBGA-M is also suitable for 1mm-ball pitch packaging requirements and stripline design where the signal trace sits between ground planes for enhanced electrical performance.

Dr. B J Han, STATS CTO said that, "With the EBGA-M, customers can achieve the high ball count needed to power their high performing devices while having the option of staying within the wire bonding process".

The EBGA-M is available in a body size up to 42.5-by-42.5mm, profile of up to 2.67mm, and a ball count of up to 836.





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