Molex PGA socket suits mobile Pentium 4, Celeron

Molex has announced the availability of the Micro PGA socket designed to be used with Intel's Mobile Pentium 4 and Mobile Celeron processors for applications such as blade servers or thin notebook PCs.

The device features BGA solder balls that are self-centering, helping prevent bent leads that can occur with standard SMT tails, especially in high pin-count applications. BGA packaging is also claimed by the company to provide good thermal control between components and the PCB for stable reflow soldering.

The socket has a 3.3mm profile, is based on a 1.27mm grid array, and accepts a PCB interposer that has the processor package mounted to it. The interposer's Micro PGA pins are inserted into the socket and a ZIF actuation cover engages the contacts by simply turning a CAM mechanism with a standard screwdriver. The CAM mechanism includes a stainless steel retainer that protects the housing from wear.

Other features of the device include a dual-beam chamfered contact design that provides low insertion force and reliable electrical performance. The LCP housing and cover can withstand high-temperature soldering environments, while gold-plated terminals provide smooth engagement, and secure electrical contact. It is rated at 100V, 0.5A.