Ziptronix technology simplifies MEMS processing

Ziptronix Inc. has introduced a room temperature, foundry-based, wafer-scale method of hermetically encapsulating surface sensitive devices (MEMS and RF devices), using industry-standard tooling, materials, and process chemicals.

Ziptronix' foundry-based process is expected to create a variety of flexible, low-cost packaging options which enable the first true integration of MEMS and IC technologies, without the complex packaging, testing, and assembly that can account for up to 80 percent of the cost of MEMS devices. The process does not require special equipment and is supported in standard fab ambient conditions.

"Ziptronix is the first company in the electronics industry to offer a process that is MEMS compatible and eliminates this special handling," said Doug Milner, CEO of Ziptronix. "Now semiconductor foundries, MEMS manufacturers, and IDMs can cost-effectively assemble, package, and test the devices in-house. This paves the way for volume commercialization of MEMS, and for streamlining their integration with electronic systems."