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Dow Corning phase material improves heat dissipation

Posted: 09 Sep 2002 ?? ?Print Version ?Bookmark and Share

Keywords:dow corning electronics? pcm 250? thermal phase change material? heat dissipation material? insulation material?

The PCM-250 thermal phase change material of Dow Corning Electronics melts at a typical temperature of 500C, dissipating heat from high power density microprocessors and other components, and improving the longevity, and reliability in semiconductor devices.

Unlike thermally conductive grease formulations, the company claims that the high melt viscosity of the new material prevents pump-out at high temperatures and helps ensure long-term device reliability, delivering the performance of grease, with application ease of pads and the reliability of silicone.

"The primary advantage of this phase change material is that it can fill small voids and reduce interfacial resistance just as a grease does under normal operating temperatures, while retaining the ease of application normally associated with thermal elastomer pads," explained Dow Corning opportunity analyst Doug Houtman.

The materials formulation makes it suitable for use between a heat generating device and heatsink, fan sink, or heat pipe assembly where mechanical fastening is already required. Its physical properties also allow easy removal and rework in the field.

The PCM-250 exhibits a thermal resistance of 0.27K-cm2/W and a thermal conductivity >6.5W/mK, providing improved heat flow.





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