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Power IC uses "package-in-package" technology

Posted: 18 Sep 2002 ?? ?Print Version ?Bookmark and Share

Keywords:on semiconductor? nis3001? power management ic? pinpak technology? dc/dc converter design?

ON Semiconductor has announced the availability of the NIS3001 power management IC housed in the company's Power Integrated Packaging (PInPAK) technology that enables the device to be integrated with a "packaged" analog driver and multiple MOSFETs into a single 10.5-by-10.5mm footprint.

The company claims that the device delivers up to 20A at 1 MHz, improves power supply efficiency by 4 percent, and reduces utilized board space by up to 50 percent on motherboards for computing and telecom platforms.

The NIS3001 is the first in a family of devices to utilize the PInPAK technology which involves the assembly of an analog-driver die housed in a standard QFN package. This analog QFN is then co-packaged in a main power QFN leadframe along with two MOSFET die.

"For the first time in the dc-dc converter industry, a fully-tested analog driver package has been co-packaged with discrete switches," said Ramesh Ramchandani, ON Semiconductor VP and GM of the Integrated Power Devices Division.

Ramchandani also said that, "This package-in-a-package approach insures 'known good die' and increases performance for high-frequency power supply designs, yet simplifies the mixed-technology manufacturing process."

The IC contains a NCP5351 QFN-packaged CMOS analog-gate driver, high side NTC60N02R, and low side NTC95N02 MOSFETs. The NIS3001 also exhibits an on-resistance of 2.6 milliohms and low parasitic inductance for high switching capabilities.

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