Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > EDA/IP
?
?
EDA/IP??

High Band Access delivers smallest FIFO die

Posted: 19 Sep 2002 ?? ?Print Version ?Bookmark and Share

Keywords:high bandwidth access? flexq? fifo queing devices? data queing ic?

High Bandwidth Access Inc. has announced the production of FlexQ FIFO queuing devices using 0.25?m process technology, allowing the company to deliver what is claimed to be the industry's smallest FIFO die.

Based on an innovative architecture and ASIC approach, the FlexQ products are positioned as direct socket replacements for IDT. The FIFOs are designed achieve speed of up to 10Gbps, enabling them to be used in OC-192 optical networking elastic buffering applications.

Available in densities from 512 bits to 4Mb - in x9, x18, x36, or x72 configurations - the FlexQ family offers retransmit, bus matching, and rate matching features. The company also offers FIFO devices with x10, x20, x40, or x80 bus widths for applications that use 10 bits bus width in analog-to-digital conversions.





Article Comments - High Band Access delivers smallest F...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top