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Fairchild establishes packaging design center in Korea

Posted: 20 Sep 2002 ?? ?Print Version ?Bookmark and Share

Keywords:packaging materials? fairchild semiconductor?

Fairchild Semiconductor has launched a Package and Technology Knowledge Center in Bucheon, South Korea. The center will focus on the research for new packaging materials to improve thermal and mechanical performance and develop new assembly techniques, working closely with global Fairchild engineering and manufacturing groups.

According to Don Desbiens, VP of technology development at Fairchild, Bucheon is an ideal location for the center because of the existing Fairchild design and manufacturing facility in that area.

"Our presence in South Korea encompasses development, manufacturing, sales, and distribution. Adding advanced Packaging capabilities will strengthen the company's team in Korea and impact our development efforts worldwide. Staffed by a highly skilled and motivated team, we expect to see the fruits of this work in new products starting in 2003," said Desbiens.

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