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Amkor increases chip package solution capacity

Posted: 26 Sep 2002 ?? ?Print Version ?Bookmark and Share

Keywords:MicroLeadFrame? semiconductor package solution? leadframe packages? PCB?

Amkor Technology Inc. is further expanding its MicroLeadFrame capacity. First developed in 1996, this semiconductor package solution became Amkor's most successful product launch when introduced in 1999, with production reaching a million units weekly after three months of qualification. The company is expecting to be able to produce more than 75 million units monthly by Q4 of this year.

MicroLeadFrame is Amkor's version of a semiconductor package with the generic nomenclature of QFN. QFNs are "leadless" leadframe packages. In traditional leadframe packages, the lead comes out of the package and is formed into a gullwing shape to create solderable feet that are mounted onto the PCB. With QFNs, on the other hand, the lead is flush in the bottom of the molded package, which is soldered directly onto the board.

"MLF has quickly become a critical package solution for cellphones, WLAN, and Bluetooth. The cellular market is increasingly moving to MLF because of its electrical and thermal performance characteristics and price/performance," said Sean Crowley, Amkor's VP of advanced leadframe products. "The markets for Bluetooth and WLAN are still in their infancy and are poised to explode. We expect to see rapid adoption of MLF solutions that are suited to solve the thermal and electrical challenges that are associated with high-frequency RF applications."

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