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Spike joins TSMC design program

Posted: 08 Oct 2002 ?? ?Print Version ?Bookmark and Share

Keywords:IC design? process technologies? concept-to-GDSII chip development?

Spike Technologies Inc., a chip design services company, has joined Taiwan Semiconductor Mfg Co.'s (TSMC) Design Center Alliance (DCA) Program. Membership to the TSMC DCA enables Spike to offer its clients that include semiconductor OEMs and fabless companies, easy access to TSMC's process technologies.

This alliance couples Spike's experience in addressing deep-sub-micron issues and their concept-to-GDSII chip development capabilities with TSMC's 0.185m and below process technologies.

"Our relationship with TSMC is a formal recognition of our ability to handle complex multimillion gate designs," said Edward Wan, CEO of Spike. "Our strengths in ASIC/SoC design with proven methodologies have resulted in first-silicon success for our customers."

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