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Tower to produce 0.135m devices with Applied Materials

Posted: 23 Oct 2002 ?? ?Print Version ?Bookmark and Share

Keywords:chipmaking equipment? physical vapor deposition? thermal processing? chemical vapor deposition? wafer inspection?

Applied Materials Inc. has received orders for chip making equipment worth more than $45 million from Tower Semiconductor Ltd, an Israel-based wafer-foundry.

Tower intends to use the equipment for the production of 0.185m and 0.135m CMOS digital logic, mixed signal, Flash memory, and image sensor devices in its new Fab 2 facility. When Fab 2 is complete, Tower plans to offer 0.185m and below process technologies and produce up to 33,000 200mm wafers per month.

Tower Semiconductor's order specified the following equipment: multiple physical vapor deposition, rapid thermal processing, etch, high-density plasma chemical vapor deposition, tungsten chemical vapor deposition, sub-atmospheric chemical vapor deposition, wafer inspection, and defect review systems.





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