Tower to produce 0.135m devices with Applied Materials

Applied Materials Inc. has received orders for chip making equipment worth more than $45 million from Tower Semiconductor Ltd, an Israel-based wafer-foundry.

Tower intends to use the equipment for the production of 0.185m and 0.135m CMOS digital logic, mixed signal, Flash memory, and image sensor devices in its new Fab 2 facility. When Fab 2 is complete, Tower plans to offer 0.185m and below process technologies and produce up to 33,000 200mm wafers per month.

Tower Semiconductor's order specified the following equipment: multiple physical vapor deposition, rapid thermal processing, etch, high-density plasma chemical vapor deposition, tungsten chemical vapor deposition, sub-atmospheric chemical vapor deposition, wafer inspection, and defect review systems.