Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > EDA/IP

PCB land pattern design and surface mount guidelines for leadless packages

Posted: 24 Oct 2002 ?? ?Print Version ?Bookmark and Share

Keywords:jedec? smd? nsmd? solder reflow? mlf?

This application note describes the land pattern design and surface-mount guidelines for leadless packages.

View the PDF document for more information.

Article Comments - PCB land pattern design and surface ...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top