Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Tower Semiconductor supports OCP Partnership

Posted: 07 Nov 2002 ?? ?Print Version ?Bookmark and Share

Keywords:wafer? ic? ocp-ip? open core protocol? soc?

Tower Semiconductor Ltd has taken part of the Open Core Protocol International Partnership (OCP-IP). The OCP-I is a non-profit corporation formed to promote and support the OCP as the complete socket standard that ensures faster creation and integration of interoperable virtual components.

As a pure-play independent wafer foundry that manufactures ICs and provides complementary manufacturing services and design support, membership to the OCP-IP is expected to enable Tower customers to shorten design cycles and bring products to market faster.

"The value an industry standard socket holds for easing the process of complex SoC design by promoting IP core reusability and reducing design time, risk, and manufacturing costs for SoC designs is clear," said John O'Boyle, worldwide director of strategic marketing for Tower.

Article Comments - Tower Semiconductor supports OCP Par...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top