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TI memory chip developed with Ramtron technology

Posted: 12 Nov 2002 ?? ?Print Version ?Bookmark and Share

Keywords:ferroelectric RAM chip? memory? CMOS logic process? fram? nonvolatile memory?

Texas Instruments (TI) has produced a 64Mb ferroelectric RAM (FRAM) chip using Ramtron Int. Corp.'s patented FRAM technology as a foundation for its next-generation non-volatile memory. With on-site development support from Ramtron's process and design teams, TI has produced a high-density FRAM on a standard CMOS logic process with only two additional mask steps.

"Working with Ramtron is the key to our successful development of high density embedded FRAM arrays," said Hans Stork, SVP and director of TI's silicon technology development. "We have looked at a number of options for an ideal embedded memory and FRAM clearly wins from a cost, performance, and manufacturability perspective. In addition, we expect FRAM to be used in a variety of innovative applications in the future."

Ramtron's development teams have been working with TI since August 2001, when the companies entered into a multi-million dollar FRAM licensing and development agreement. In addition to licensing and development fee revenue associated with the partnership, Ramtron has the right to use the jointly developed ferroelectric technology to design, produce and sell its own high-density, standalone, FRAM memory products. Ramtron's high-density, standalone memory products could be available as early as 2004.





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