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Fujitsu stacked memory MCP targets new cellphone apps

Posted: 13 Nov 2002 ?? ?Print Version ?Bookmark and Share

Keywords:fujitsu? mb84vy6a4a1? stacked memory? memory mcp? multichip package?

The MB84VY6A4A1 MCP from Fujitsu Ltd stacks three Flash, one SRAM, and two FCRAM devices in a single 15-by-11-by-1.4mm and is targeted at new cellphone applications such as digital photo, Internet, music, and video distribution capabilities.

The device uses the company's Package Stacked MCP (PC-MCP) technology to bond a pair of packages into a single unit that includes all six memory chips. The package is divided into two independent data buses, allowing data and programs to be processed simultaneously and reduce process time.

The MCP is divided into a four-chip upper package and a two-chip lower package. The upper package includes 128Mb NOR-type dual operation Flash memory with page read mode, 64Mb NOR-type dual operation Flash memory, 64Mb mobile FCRAM, and 32Mb mobile FCRAM. The lower section includes 32-Mbit NOR-type dual operation Flash, with 8Mb SRAM.

The bus width is 16 bits, while the operating voltage is 2.850.15V, with operating temperature from -25C to 85C. The MCP can accommodate up to 100,000 erase/write repetitions. Sample prices start at $65 each and will be available by the end of November.





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