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Oki brings environment-friendly packaging to its facilities

Posted: 22 Nov 2002 ?? ?Print Version ?Bookmark and Share

Keywords:lead-free solder plating technology? semiconductor packaging? lsi? pcb?

Oki Electric Ind. Co. Ltd has successfully developed a lead-free solder plating technology for semiconductor package terminals. Introducing this technology at its production facilities enables the company to implement a totally lead-free LSI production in all its semiconductor production bases.

Oki has been developing its environmental protection programs since 1993. As part of its "Oki Eco Plan 21" set forth in 2001, it set a goal of totally lead-free soldering for all products manufactured in Japan by the end of the fiscal year ending March 2004. The company has already completed the development of lead-free soldering to mount semiconductors to PCBs, and Nagano Oki Electric Co. Ltd, a wholly owned subsidiary, has begun mass production of lead-free soldered boards.

The technique developed by Oki involves a lead-free solder plating technology for semiconductor package terminals. Oki has confirmed the reliability of its lead-free soldering technology by implementing reliability tests for the major types of outer lead frames for semiconductor packages, including DIP, QFP, and SOP, as well as BGA and CSP types of ball-type semiconductor packages.

The company already introduced lead-free plating equipment based on this technology in the assembly processes of production facilities, including Miyazaki Oki Electric Co. Ltd, and Oki Co. Ltd, as well as their business partners.

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