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DEK rolls bumping solution for 300mm wafers

Posted: 08 Jan 2003 ?? ?Print Version ?Bookmark and Share

Keywords:dek? wafer bumping solution? 300mm wafer handler? wafer handling system?

DEK has announced the availability of a production wafer bumping solution for 300mm wafers that uses the company's mass imaging technology for back end wafer processing and wafer handling technology developed with Adept Semiconductor Handling Division.

The new system builds on DEK's existing back end solutions for 150mm and 200mm wafers, and is capable of transferring 300mm wafers from open cassettes of FOUPs into the processing station. The system then automatically returns the wafers to the cassette or FOUP or directly to the reflow oven when the processing is complete.

The wafers are transported by a conveyor, integrated into the system via standard, SMEMA-compliant interfaces.

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