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Manufacturing/Packaging??

SUSS device bonders create sub-100nm patterns

Posted: 13 Jan 2003 ?? ?Print Version ?Bookmark and Share

Keywords:suss microtech? device bonder? fc150? fc250? bonding machine?

SUSS MicroTec has announced that its FC150 and FC250 device bonders are now capable of creating patterns of 100nm and below through imprint lithography technologies.

The device bonders use print patterns (stamps/templates) rather than optical lithography to create the tiny patterns required for devices aiming at the optoelectronics and biotech markets such as optical grating couplers and membrane chips for filtration of bacteria or cells in the biomedical, pharmaceutical, and food industries.

Imprinting lithography technologies generally use a structured stamp or template made of quartz or silicon to print patterns into a polymer deposited on the wafer. Some approaches allow imprinting lithography to be performed on the wafer level using a template as big as the wafer. Other methods use smaller templates which print step by step until the entire wafer is structured.

The template itself is built with the help of Electron Beam lithography (EBL) or UV lithography, similar to creating photomasks. After the printing step, the structured resist is used for subsequent pattern transfer.

Two lithography processes are currently used: hot embossing lithography, also called nano-imprint lithography (NIL) and cold embossing or step and flash imprint lithography (SFIL).

With NIL, heat and high pressure are applied to create the structures. A mold with nanostructure relief is pressed into a thin thermoplastic film heated over its glass transition temperature. After demolding and a reactive ion etching step the wafer is covered with the thermoplastic film and with windows through the film according to the pattern.

The high pressure required of around 35kg for an area of 5-by-5mm limits the size of the stamp. However, if only one level is required, the stamp could be as large as the wafer thus taking advantage of the benefits of wafer level manufacturing. The key advantage of HEL is the sub-10nm resolution capability with low cost mass production potential, the company claims.

With SFIL, a liquid polymer is used which is cured by the help of UV light. The advantage is that not much force is required, so there are no limits for the size of the stamp even if more than one level has to be printed.





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