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Vishay HDIs feature enhanced signal routing

Posted: 15 Jan 2003 ?? ?Print Version ?Bookmark and Share

Keywords:vishay? high density interconnect? thin film substrate? resistor substrate?

Vishay Intertechnology Inc. has announced the release of thin-film, single- and multilayer high-density interconnects (HDIs) with enhanced signal routing and response conditioning that integrate conductor patterns and other passive components in custom resistor solutions.

Designed by Vishay Electro-Films, the substrates are specified for use in microwave circuitry and hybrid circuitry in low-noise amplifiers, avionics, satellites, and medical instrumentation.

The HDIs maybe manufactured in designs of up to five layers and with special shapes, vias, and patterns. They can have areas from 0.5-by-0.5mm to 101.6-by-101.6mm with thickness ranging from 0.127mm to 1.27mm. Each is available with a nichrome or tantalum nitride resistor element and a variety of materials that include conductor and adhesion metals.

Additional options include metallized through holes, backside metallizing and patterning, wrap-around patterned edges, thick copper power line conductors, filled vias for added low-thermal-conductivity paths to a ground plate heatsink, and both aluminum and gold wire bond pads on the same substrate to provide monometallic interfaces in very-high-temperature applications.

Multi-level metallization is achieved using polyimide insulation. Available substrates are alumina, beryllium oxide, aluminum nitride, quartz, and silicon.

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