Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

TI, SLE to co-develop complex ASICs for high-end markets

Posted: 23 Jan 2003 ?? ?Print Version ?Bookmark and Share

Keywords:asic? texas instruments? ti? sle? ip?

Texas Instruments Inc. (TI) and Silicon Logic Engineering Inc. (SLE) have agreed to jointly develop complex ASICs for TI customers in the wireless/wireline infrastructure and computing markets.

Under the agreement, SLE will provide semiconductor design services and intellectual property (IP) to support the ASICs manufactured in TI's 130nm and below process technologies. The agreement with SLE is also expected to augment TI's ability to offer a "specification to production" engagement model designed to ease customers from resource-intensive ASIC implementation tasks.

"TI's collaborative approach to high-end ASIC design gives our customers access to experienced semiconductor design and manufacturing process expertise," said Steve Sutton, VP of TI's ASIC business unit. "The agreement with SLE provides an additional route to 130nm designs without tying up our customer's mission-critical resources for RTL implementation."





Article Comments - TI, SLE to co-develop complex ASICs ...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top