Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

ChipMOS enhances chip making with latest assembly, testing technology

Posted: 28 Jan 2003 ?? ?Print Version ?Bookmark and Share

Keywords:chip-on-film assembly? testing technology? chips? LCD? driver IC?

Taiwan-based ChipMOS Technologies (Bermuda) Ltd has introduced its newly developed chip-on-film (COF) assembly and testing technology with inner lead pitch below 405m. In relation to this, the company also launched its COF module technologies used in cellular phone manufacturing.

According to ChipMos, the COF is expected to replace TCP as the mainstream LCD driver IC assembly technology in the future.

"The COF technology has been qualified by many customers and is now in mass production with 385m inner lead pitch," said S.J. Cheng, deputy chairman and CEO of ChipMOS/Bermuda. "We are currently developing finer inner lead pitch COF technologies, and expect the COF technology with 305m inner lead pitch to be announced within this year."

Article Comments - ChipMOS enhances chip making with la...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top