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Dow Corning to acquire Tyco Electronics business unit

Posted: 30 Jan 2003 ?? ?Print Version ?Bookmark and Share

Keywords:dow corning? raychem? power materials? tyco electronics? fabricated thermal interface materials?

Dow Corning Corp. has signed a definitive agreement to acquire the Raychem Power Materials Business Unit of Tyco Electronics, in a move to expand its share of the fabricated thermal interface materials market. The acquisition is expected to be completed by the end of Q1.

Under the terms of agreement, Dow Corning will obtain the Power Materials Business Unit's fabricated thermal interface materials (TIMs), EMI and RFI shielding products, as well as certain connector sealing products that have been sold under the trademarks GELTEK, HEATPATH, and DBSEAL.

Along with the unit's three product lines, Dow Corning will acquire its intellectual property rights, including patents associated with the product lines. The products will continue to be manufactured at the facility currently used for production in Menlo Park, California. All of the Tyco Electronics Power Materials Unit employees will become employees of Dow Corning.

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