Samsung, Infineon co-develop solution for smart phones

Samsung Electronics and Infineon Technologies have jointly developed a semiconductor system solution combining both companies' technologies. The device combines the Samsung SiP (System in Package) processor and the Infineon GSM/GPRS dual mode modem chipset and Symbian OS v6.1.

The semiconductor solution is designed to provide various multimedia functions in applications, such as camera, image capture, VOD (video on demand), MP3 player, and JPEG viewer. The 17-by-17-by-1.4mm device is suitable for use in smart phones.