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VIA enhances wireless design capabilities with new acquisition

Posted: 07 Mar 2003 ?? ?Print Version ?Bookmark and Share

Keywords:via technologies? acreo? silicon? wireless communications? internet?

VIA Technologies Inc., a provider of silicon chip technologies and PC platform solutions, has acquired a wireless applications design center co-established with Swedish microelectronics institute Acreo in 2001.

Located in Lund, Sweden, in the heart of one of the world's major research communities developing wireless technologies, the VIA wireless design center is dedicated to RF technology design. The center enhances wireless system application R&D capabilities to VIA's silicon and platform product portfolio.

"The demand for wireless Internet access is becoming ever more pervasive, so we believe the development of wireless communications is an essential element to provide customers with the necessary products to serve this market," said Wenchi Chen, President and CEO of VIA Technologies, Inc. "In less than two years, we are reaping the benefits of our partnership with Acreo, enabling VIA to boast wireless system design capabilities as yet another important building block in our overall strategy."

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