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Sharp, Amkor to develop unified stacked package design

Posted: 10 Mar 2003 ?? ?Print Version ?Bookmark and Share

Keywords:sharp? amkor? 3D system? ic package? stacking?

Sharp Corp. and Amkor Technology Inc. have agreed to unify the design for 3D system in package assembly that enables the stacking of very thin packages.

Targeting ASICs, DSPs, and memories for the cellphone, PDA, digital still camera markets, the two companies will develop and enhance a standard industry stacked package format utilizing Amkor's stackable etCSP package and Sharp's package stacked CSP. The first proposal for the new package format, coined 3D-SiP, will be to standardize the terminal position of individual, stackable packages containing ASIC and memory devices.

According to Morihiro Kada, Sharp's general manager for packaging development department, through the 3D-SiP format, individual packages can be stacked onto one another, making it easy to combine LSIs such as ASIC and memory devices. "By using 3D-SiP, more complicated functions and higher density systems are available while maintaining device performance and reliability. By having access to a global standard in 3D-SiP design, end customers can benefit from the convenience in motherboard designing, and multi-sourcing components," added Kada.

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