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NEC to integrate Tera Systems technology in ISSPs

Posted: 12 Mar 2003 ?? ?Print Version ?Bookmark and Share

Keywords:nec electronics? tera systems? rtl design consultant? virtual prototype technology? instant silicon solution platform?

NEC Electronics Corp. has selected Tera Systems Inc.'s TeraForm RTL Design Consultant (RDC) and Virtual Prototype (VP) technologies to be included in its Instant Silicon Solution Platform (ISSP) OpenCAD design flow. NEC chose the Tera Systems TeraForm product to simplify the customer design flow for ISSP designs and ensure performance predictability, thereby reducing design turnaround time.

According to NEC, the ISSP is a new class of ASIC device based on a cost-effective, high-integration, easy-to-design ASIC architecture. Targeting mid-volume designs, ISSPs combine the performance found in cell-based ASICs with an easier design flow.

"Incorporating TeraForm's RDC and VP technology into NEC Electronics' ISSP flow provides our customers with realizable benefits in terms of lowered costs and faster, more predictable schedules," said Dr. Hitoshi Yoshizawa, GM, 3rd Custom LSI Division, NEC. "By integrating this technology into NEC Electronics' flow, we are enabling our customers to pinpoint issues at the register transfer level, thereby reducing costly iterations."

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