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Cadence adds wire bonding capability to packaging tool

Posted: 14 Mar 2003 ?? ?Print Version ?Bookmark and Share

Keywords:cadence design system? advanced package designer? stacked package designer? stacked package tool? package design tool?

Cadence Design Systems Inc. has announced the addition of a new wire bonding capability to its Advanced Package Designer for designs using stacked packages.

The stacked-die package is growing in popularity in cellphone, digital cameras, and handheld device designs, which require the faster turnaround, higher levels of integration and lower costs found in system-in-package (SiP) solutions.

But designing stacked-die packages has been a difficult process since it requires a wire bonding technique that interconnects to the substrate. A single package design may also have hundreds of wires and multiple-bond patterns for various die combinations on a single substrate.

The new wire bonding capability in the Cadence Advanced Package Designer Suite automates the design process and addresses reliability issues through advanced wire spacing and automated realignment features, the company said.

Features include the ability to bond as many die as desired, use of different spacing rules for each die and quadrant, and the creation multiple bonding patterns so that one substrate can handle multiple-die combinations.

Cadence said it expects the tool to be available in Q3 of this year. Cadence Advanced Package Designer is priced at $27,000 for a one-year license.

- Michael Santarini

EE Times





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