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Winbond lends Flash memory process NexFlash

Posted: 21 Mar 2003 ?? ?Print Version ?Bookmark and Share

Keywords:winbond electronics? nexflash technology? flash memory?

Winbond Electronics Corp. of Taiwan has agreed to a foundry agreement with NexFlash Technology Inc. Under the terms of the agreement, NexFlash will be allowed to design and produce Flash memory products utilizing Winbond's 0.185m WinStack Flash Memory process. NexFlash is set to introduce a new line of serial flash memories in 2H of 2003 to be manufactured at Winbond's fab.

"Winbond's manufacturing facilities will enable NexFlash to mass-produce cost-effective and quality Serial Flash products," said Thomas Liao, president and CEO of NexFlash.





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