Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Sanmina-SCI licenses capacitance technology to Oak-Mitsui

Posted: 25 Mar 2003 ?? ?Print Version ?Bookmark and Share

Keywords:sanmina-sci? oak-mitsui? film-based substrate? buried capacitance technology? electronic interconnect?

Sanmina-SCI Corp., an electronics contract manufacturer and PCB fabricator, has announced that Oak-Mitsui Technologies has signed a licensing agreement to manufacture and market thin, film-based substrates using Sanmina's patented Buried Capacitance technology. Oak-Mitsui specializes in the development and production of performance copper foils, aluminum-bonded-copper (ABC), and advanced materials for electronic interconnect (PCB /chip packaging) applications.

Buried Capacitance is Sanmina-SCI's patented technology that enables designers to remove discrete capacitor components from the surface and replace them with a capacitive layer embedded inside the PCB. Under the terms of the agreement, the Oak-Mitsui FaradFlex line of materials will be immediately available to Sanmina-SCI's existing family of licensed PCB manufacturers.

The two companies will also collaborate to jointly develop higher value capacitance materials using patented applications of barium titanate nanopowders to increase the dielectric constant of the material.

Article Comments - Sanmina-SCI licenses capacitance tec...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top