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Xilinx qualifies for 300mm production at UMC

Posted: 01 Apr 2003 ?? ?Print Version ?Bookmark and Share

Keywords:xilinx? virtex-II pro? wafer? umc? cmos technology?

Xilinx Inc. has announced production qualification for its 130nm Virtex-II Pro on 300mm wafers with fab partner United Microelectronics Corp. (UMC) at the latter's manufacturing facility, Fab12a, in Taiwan.

Xilinx's strategy to deploy 130nm CMOS technology on 300mm wafers is expected to benefit its customer base by providing a proven cost reduction path without the need for re-qualification. According to Xilinx, the 300mm wafer process offers improved defect densities, as well as about 2.5 times the number of gross die per wafer relative to 200mm processes.

"We've always considered 300mm production as a necessary component of our manufacturing strategy and a necessary step in ensuring customer satisfaction," said Wim Roelandts, president and CEO at Xilinx. "300mm provides the lowest cost of manufacture, lowest defect density, and most advanced high-volume process technology options. Going forward, all Xilinx products will go directly into production on the more cost effective 300mm wafers."





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